Our Services
ATMP/OSAT Startup Services including Factory Build, Operate, Transfer (BOT)
OSAT Management Services
Training Center Development
Equipment Procurement and Installation
Product and Process Qualification
Package Design and Manufacturing Development
Factory Due Diligence and Auditing Services
Cost Modeling
Risk Assessment and Risk Mitigation
Government and Private Partnership Development
Semiconductor Product Ecosystem Consulting
Sales and Business Development Support
ATMP/OSAT STARTUP PARTNER
OSAT Management Services
Your Product, Our Manufacturing Expertise
Our expertise in semiconductor manufacturing and supply chain management enables our customers to optimize outsourcing processes, ensuring high-quality production, reduced time-to-market, and cost efficiency.
Benefits of PTC OSAT Management
Sample Team Deployment Customized to Your Needs
Semiconductor Training Center Development
Specialty consulting services to assist industry partners, educational institutions, and government agencies in setting up customized Semiconductor Training Centers.
Customized Training Center Set Up Key Milestones
Package/Product Experience Examples
IC Package Legacy Product
PLCC Families
SOIC Families
SOT Families
TO Families
SOP Families
QFP Families
TSOP Families
QFN module (stack Die)
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- Typically having flash memory die (EEPROM) stacked on controller die.
- Options of multiple controller for increased functionality.
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Power QFN Package
Single Cool
Dual Cool
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- Power QFN combined with copper clip replaces the traditional wire bond interconnect for high performance MOSFETs by providing lower resistance and inductance than multiple wire bonds to improve thermal performance.
- Options of Single-Cool (embedded Cu clip) and Dual-Cool (expose Cu clip).
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Memory Devices
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- Different variance of memory packages : TSOP, micro-SD, SD Card and USB.
- Multiple stack NAND die with different technology with thickness up to 4 stack.
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CMOS Image Sensor Product
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- CMOS Image Sensor with different platform of CLCC (Ceramic) and iBGA (laminate substrate).
- Commonly used in automotive, unattended surveillance, stereo vision, security, smart vision, automation, and machine vision.
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BGA with Expose Heat Spreader
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- Heat spreader attached on top of punch BGA for improved thermal performance.
- Typically used on a device having high thermal conductivity that is used to move heat from a concentrated or high heat flux source to a heat exchanger with a larger cross section area, surface area, and volume.
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Power QFN/LGA/BGA Module with Thick Component (5mm thickness package)
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- Controller IC die/package with typical passive component & large component such as an inductor.
- Substrate interposer to improve circuit routabality.
- Multiple copper wires and/or Al ribbon for power application.
- SIP integration to improve device functionality and performance.
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RF SIP LGA/ BGA Module with COB
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- Multi die LGA module with passive component for QFN application.
- Key Features:
- Compact design
- Short wire length
- Cost efficient
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RF SIPLGA/ DSMBGA Module with SMT + MCOB
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- Double Sided Molded Ball Grid Array (DSMBGA) package which allows molded assembly of components on both sides of the substrate.
- SIP module is a package that contains an electronic system or sub-system and is miniaturized through IC assembly.
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