Bio :

• Started as a Test Engineer at Texas Instruments and moved on to management and leadership roles in Product Engineering, Factory Engineering, and Business Development at Fairchild/National Semiconductor and STATS ChipPac. ​
• At STATS ChipPac as their Engineering Head, helped build OSAT in Singapore from the ground up and later went on to a role in Sales & Marketing. ​
• Built up Sales & Marketing and Business Development departments at UTAC and DTS. ​
• In 2003, Raja founded Tessolve with a goal of providing industry leading semiconductor engineering services. Successfully sold company. ​
• 2021 became the first CEO of TATA Electronics – OSAT. ​
• 2023 founded PTC with the goal of expanding the semiconductor eco system throughout emerging tech markets.  

Expertise & Skillset:

• Semiconductor Packaging and Test
• Business Development
• Sales & Marketing
• Government and Private Partnerships
• Factory Development and Management
• Product Engineering
• Entrepreneurship

Bio:

• Multi-faceted experience and background in Human Resources, Business Operations, Business Development, and Entrepreneurship. ​
• Strong hands-on work experience from the Electronics Manufacturing Industry along with experience in Test Engineering and Consulting Services. ​
• Previous management at Krypton Solutions, Tessolve, and ADLINK Technology. ​

Expertise & Skillset:

• Business Operations
• Human Resources
• Business Development
• Entrepreneurship
• Business Unit and Executive Guidance
• Business Process/System Development and Implementation 

Bio:

• Highly accomplished engineer with more than 40 years in the field of Semiconductor IC Assembly and Testing. ​
• Began his career as a junior engineer at Mostek, a leading semiconductor company in Malaysia during the 1970s.​
• Developed cutting-edge assembly techniques and technologies for semiconductor industry leaders such as AMD, Spansion, and ASE.​
• Lead different product portfolios of Semiconductor ICs, enabling a cross functional expertise with product, process, and equipment.​
• Strong relationships with top customers, as well as tier one suppliers of equipment and material in the Semiconductor IC assembly domain. ​
• Strong innovator with 2 patent rights to his name.​

Expertise & Skillset:

• Equipment automation, selection, and maintenance
• Experience in new package/product development, EOL Engineering
• Factory Operations and Technical Leadership

Bio:

• Began his career at Intel in 1996, specializing in assembly packaging, process engineering, NPI, and process development engineering. Led the transfer of advanced microprocessor packaging technologies from Arizona to Malaysia.​
• At Fairchild Semiconductor, managed and lead subcontractors’ assembly test process development and qualification. Successfully transferred technology from Fairchild Penang to other OSAT factories and served as the primary customer interface throughout project lifecycle while spearheading backend integration projects and optimizing global operations. ​
• At Advanced Semiconductor Engineering (ASE Malaysia), specialized in advanced packaging and process engineering, while also managing Cu Clip Power QFN, Memory, and Smartcard technologies. Drove productivity and capacity enhancement in Cu Clip PQFN Assembly.​
• At Inari Technology Sdn. Bhd., supervised assembly operations and engineering teams as Deputy Vice President for Penang and Batu Kawan factories. Lead 700+ employees and held responsibility for NPI and HVM matters, establishing new business units, fostering productivity enhancements, and spearheading pioneering package development projects. ​
• More than 28 years of working experience in the Integrated Device Manufacturers (“IDM”) and the Outsourced Semiconductor Assembly and Test (“OSAT”) industry, with experience leading from package development until high volume manufacturing operations, business development, and managing key customer relationships.​

Expertise & Skillset:

• NPI
• Project Transfers
• Operations
• Engineering
• Quality Assurance
• New Package Development including Power QFN (Cu Clip), Memory, and RF products

Bio:

• Started his career in 1996 as a Leadframe Design Engineer at Dynacraft Industries in Malaysia and moved on to a leadership role in managing Product Design and Product/Process Development. ​
• At ASE (Malaysia) managed package design and lead new product and process development. Progressed to head the mechanical/electrical simulation and modelling team. ​
• Experience with multiple packaging platforms and has successfully developed power QFN (Cu clip) packages, different variance of memory products, ultra-high density LFmigration, RF devices, different variance of QFN packages (thin/thick/stack/SIP) and multiple niche package development. ​
• At Lumileds (Malaysia), managed new package development. Invented 4 US patents on Auto-front lighting micro-LED.​
• At PTC, continues to strive with an eye for the most cost-effective designs while maintaining top notch quality.

Expertise & Skillset:

• Package Design and Development including IC, Power, RF, Memory, Sensor, and LED applications​
• Project Management
• Project Transfer​

Bio:

• Started as a Wire Bonding Process Technician at Carsem and moved on to become a Wirebond Process Engineer at ASE after completing his degree in Mechanical Engineering. ​
• AT ASE, progressed into quality leadership and in 2006, was assigned to manage and strengthen ASE (Malaysia) labs ( FA/Rel/IQA/Cal/ESD/MSA), bringing significant improvements to the lab’s operations and efficiency. Additionally, headed ASE’s (Malaysia) Incoming Quality Assurance (IQA), and was responsible in leading IQA team to drive supplier quality improvement.​
• At Cortina Networks and later Inphi Corporations, managed supplier quality for Tier 1 OSATs (ASE Group, Amkor, Statschippac) in the Asia Pacific region. Responsibilities also included Product Transfer and new OSAT Qualification. Progressed to manage the entire assembly process for wirebonded and Flip Chip packages.​
• At PTC, RP continues to bring strong quality leadership experience to our customers. ​

Expertise & Skillset:

• Process Engineering including Flip Chip and Wire Bond
• QA Lab – IQA, FA, Rel, ESD Cal.
• Supplier/Customer Audits & Qualification